B. Nguyen, A. Thean, T. White, A. Vandooren, M. Sadaka, L. Mathew, A. Barr, S. Thomas, M. Zalava, Da Zhang, D. Eades, Zhonghai Shi, J. Schaeffer, D. Triyoso, S. Samavedam, V. Vartanian, T. Stephen, B. Goolsby, S. Zollner, Ran Liu, R. Noble, T. Nguyen, V. Dhandapani, B. Xie, X. Wang, J. Jiang, R. Rai, M. Sadd, M. Ramón, S. Kalpat, L. Prabhu, V. Kaushik, Y. Du, T. Dao, M. Mendicino, Marius K. Orlowski, P. Tobin, J. Mogab, S. Venkatesan
{"title":"Integration challenges of new materials and device architectures for IC applications","authors":"B. Nguyen, A. Thean, T. White, A. Vandooren, M. Sadaka, L. Mathew, A. Barr, S. Thomas, M. Zalava, Da Zhang, D. Eades, Zhonghai Shi, J. Schaeffer, D. Triyoso, S. Samavedam, V. Vartanian, T. Stephen, B. Goolsby, S. Zollner, Ran Liu, R. Noble, T. Nguyen, V. Dhandapani, B. Xie, X. Wang, J. Jiang, R. Rai, M. Sadd, M. Ramón, S. Kalpat, L. Prabhu, V. Kaushik, Y. Du, T. Dao, M. Mendicino, Marius K. Orlowski, P. Tobin, J. Mogab, S. Venkatesan","doi":"10.1109/ICICDT.2004.1309953","DOIUrl":null,"url":null,"abstract":"In this paper, we will detail the issues with new materials being introduced into CMOS devices and present some potential solutions to enable high performance and low power CMOS for the 65nm node and beyond.","PeriodicalId":158994,"journal":{"name":"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)","volume":"221 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2004.1309953","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper, we will detail the issues with new materials being introduced into CMOS devices and present some potential solutions to enable high performance and low power CMOS for the 65nm node and beyond.