190 GHz InP HEMT MMIC LNA with dry etched backside vias

M. Barsky, R. Lai, Y. Kok, M. Sholley, D. Streit, T. Block, P. Liu, E. Sabin, H. Rogers, V. Medvedev, T. Gaier, L. Samoska
{"title":"190 GHz InP HEMT MMIC LNA with dry etched backside vias","authors":"M. Barsky, R. Lai, Y. Kok, M. Sholley, D. Streit, T. Block, P. Liu, E. Sabin, H. Rogers, V. Medvedev, T. Gaier, L. Samoska","doi":"10.1109/ICIPRM.1999.773723","DOIUrl":null,"url":null,"abstract":"We report an InP HEMT MMIC LNA incorporating dry etched backside ground plane vias with an on-wafer measured peak gain of 9.6 dB at 190 GHz. The 2-stage balanced LNA exhibited over 7 dB gain across a 30 GHz bandwidth. The high gain and high operating frequency of the amplifier is attributed to the lower source inductance provided by the 25 /spl mu/m dry etched ground vias, the 80 nm T-gate, and the graded In/sub 0.80/Ga/sub 0.20/As channel HEMT.","PeriodicalId":213868,"journal":{"name":"Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIPRM.1999.773723","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

Abstract

We report an InP HEMT MMIC LNA incorporating dry etched backside ground plane vias with an on-wafer measured peak gain of 9.6 dB at 190 GHz. The 2-stage balanced LNA exhibited over 7 dB gain across a 30 GHz bandwidth. The high gain and high operating frequency of the amplifier is attributed to the lower source inductance provided by the 25 /spl mu/m dry etched ground vias, the 80 nm T-gate, and the graded In/sub 0.80/Ga/sub 0.20/As channel HEMT.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
带干蚀刻背面过孔的190ghz InP HEMT MMIC LNA
我们报道了一种采用干蚀刻背面地平面通孔的InP HEMT MMIC LNA,其在190 GHz时的片上测量峰值增益为9.6 dB。两级平衡LNA在30 GHz带宽上的增益超过7 dB。放大器的高增益和高工作频率归功于25 /spl mu/m干蚀刻接地通孔、80 nm t栅和渐变In/sub 0.80/Ga/sub 0.20/As通道HEMT提供的较低源电感。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
InP-based thermionic coolers Length dependence of quantized conductance in etched GaAs/AlGaAs quantum wires Contacting of buried InP-based layers by epitaxial overgrowth over patterned tungsten features Monolithically integrated 40-Gb/s InP/InGaAs PIN/HBT optical receiver module Optimizing InP HBT technology for 50 GHz clock-rate MSI circuits
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1