K. Wadhwa, R. Schlangen, J. Liao, T. Ton, H. Marks
{"title":"Failure analysis of low-ohmic shorts using lock-in thermography","authors":"K. Wadhwa, R. Schlangen, J. Liao, T. Ton, H. Marks","doi":"10.1109/IPFA.2014.6898146","DOIUrl":null,"url":null,"abstract":"This paper will present the non-destructive Lock-in thermography (LIT) technique and its application in detecting low-ohmic power shorts in 28 nm GPU (Graphics processing units). LIT was successful in detecting power shorts within die and package down to 5 Ohms within seconds, leading to accurate and efficient root cause analysis.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898146","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
This paper will present the non-destructive Lock-in thermography (LIT) technique and its application in detecting low-ohmic power shorts in 28 nm GPU (Graphics processing units). LIT was successful in detecting power shorts within die and package down to 5 Ohms within seconds, leading to accurate and efficient root cause analysis.
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