{"title":"Enhancement of localization capability of lock-in thermography for power semiconductor devices by searching high-emissivity films","authors":"N. Chinone, T. Matsumoto, K. Koshikawa","doi":"10.1109/IPFA47161.2019.8984828","DOIUrl":null,"url":null,"abstract":"We will demonstrate the capability of lock-in thermography (LIT) for fault localization in a packaged power semiconductor device by using high-emissivity film. Different types of films were investigated to explore suitable type of film for LIT. Pasting the selected film on the heatsink of a packaged device increased the signal-to-noise ratio of LIT analysis, which enhanced the nondestructive localization ability of LIT.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"312 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984828","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We will demonstrate the capability of lock-in thermography (LIT) for fault localization in a packaged power semiconductor device by using high-emissivity film. Different types of films were investigated to explore suitable type of film for LIT. Pasting the selected film on the heatsink of a packaged device increased the signal-to-noise ratio of LIT analysis, which enhanced the nondestructive localization ability of LIT.
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