Atomic-scale planarization of Ge (111), (110) and (100) surfaces

T. Nishimura, C. Lee, T. Yajima, K. Nagashio, A. Toriumi
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Abstract

The Ge surfaces are planarized in H2 annealing with atomically flat manner on (110) and (100) surfaces in addition to that on (111) surface. The terrace widths on (111) and (110) are almost controlled by the off-angle of the initial surface. The low thermal budget of 500°C in H2 to form the atomically flat surface is advantageous for the device fabrication on Ge (111) and (110) surfaces, because these surface orientations fortunately are expected to facilitate the high electron and hole mobility for n- and p-FETs, respectively.
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Ge(111)、(110)和(100)表面的原子尺度平面化
在H2退火中,除(111)表面外,(110)和(100)表面上的Ge表面以原子平坦的方式平面化。(111)和(110)的阶地宽度几乎由初始表面的离角控制。在H2中形成原子平面的500°C的低热平衡对于在Ge(111)和Ge(110)表面上制造器件是有利的,因为幸运的是,这些表面取向有望分别促进n-和p-场效应管的高电子和空穴迁移率。
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