{"title":"ICP-RIE Platinum (Pt) sputter etching","authors":"R. Mendaros, M. Marcelo","doi":"10.1109/IPFA.2014.6898195","DOIUrl":null,"url":null,"abstract":"One of the coating materials that is used to reduced electron charging effect during Scanning Electron Microscope (SEM) imaging is Platinum (Pt). Removing Pt coating for parts requiring further electrical testing or deprocessing has been a challenge in failure analysis. This paper discusses the established methodology in removing Pt coating using the ICP-RIE sputter etching technique.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898195","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
One of the coating materials that is used to reduced electron charging effect during Scanning Electron Microscope (SEM) imaging is Platinum (Pt). Removing Pt coating for parts requiring further electrical testing or deprocessing has been a challenge in failure analysis. This paper discusses the established methodology in removing Pt coating using the ICP-RIE sputter etching technique.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
