On-chip and on-board RF noise coupling and impacts on LTE wireless communication performance (Invited)

M. Nagata, N. Miura, S. Muroga, Satoshi Tanaka, M. Yamaguchi
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Abstract

In-band interferers due to noise coupling from baseband digital circuits significantly impact on the wireless communication performance, in the case of single-chip system-level integration. The on-chip and off-chip (on-board) noise coupling are measured for visualizing the noise couplings. In addition, the hardware-in-the-loop simulation (HILS) estimates their impacts on the performance metrics like throughputs, under the interactions of interferers with the operation of LTE-compliant RF receiver circuits in a 65 nm CMOS technology.
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片上和板上射频噪声耦合及其对LTE无线通信性能的影响(特邀)
在单芯片系统级集成的情况下,基带数字电路的噪声耦合引起的带内干扰对无线通信性能的影响很大。对片内和片外(板上)噪声耦合进行了测量,以使噪声耦合可视化。此外,硬件在环仿真(HILS)估计了它们对吞吐量等性能指标的影响,在干扰与65nm CMOS技术中符合lte标准的射频接收器电路的运行相互作用下。
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