{"title":"75–85 GHz flip-chip phased array RFIC with simultaneous 8-transmit and 8-receive paths for automotive radar applications","authors":"B. Ku, O. Inac, Michael Chang, Gabriel M. Rebeiz","doi":"10.1109/RFIC.2013.6569607","DOIUrl":null,"url":null,"abstract":"This paper presents the first simultaneous 8-transmit and 8-receive paths 75-85 GHz phased array RFIC for FMCW automotive radars. The receive path has two separate I/Q mixers each connected to 4-element phased arrays for RF and digital beamforming. The chip also contains a build-in-self-test system (BIST) for the transmit and receive paths. Measurements on a flip-chip prototype show a gain >24 dB at 77 GHz, -25 dB coupling between adjacent channels in the transmit and receive paths (<;-45 dB between non-adjacent channels), and <;-50 dB coupling between the transmit and receive portions of the chip.","PeriodicalId":203521,"journal":{"name":"2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"26","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC.2013.6569607","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 26
Abstract
This paper presents the first simultaneous 8-transmit and 8-receive paths 75-85 GHz phased array RFIC for FMCW automotive radars. The receive path has two separate I/Q mixers each connected to 4-element phased arrays for RF and digital beamforming. The chip also contains a build-in-self-test system (BIST) for the transmit and receive paths. Measurements on a flip-chip prototype show a gain >24 dB at 77 GHz, -25 dB coupling between adjacent channels in the transmit and receive paths (<;-45 dB between non-adjacent channels), and <;-50 dB coupling between the transmit and receive portions of the chip.
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