Vertical floating-gate 4.5F/sup 2/ split-gate NOR flash memory at 110nm node

D. Lee, F. Tsui, Jeng-Wei Yang, F. Gao, Wen-Juei Lu, Yeeheng Lee, Chi-Tsai Chen, V. Huang, Pin-Yao Wang, M. Liu, H. Hsu, S. Chang, S.Y. Chang, H. van Tran, J. Frayer, Yaw-Wen Hu, B. Yeh, B. Chen
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引用次数: 4

Abstract

We present the structural and electrical characteristics of the latest generation of a self-aligned split-gate NOR memory incorporating a vertical floating-gate channel having 4.5F/sup 2/ area on 110 nm half-pitch rules. With enhanced electric fields for erase and programming, the cell achieves erase time < 1 ms and program time < 10 /spl mu/s at 100nA programming current. These results demonstrate continued scalability of the SuperFlash cell for high-density, high-speed applications.
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110nm节点垂直浮栅4.5F/sup 2/分栅NOR闪存
我们介绍了最新一代自校准分栅NOR存储器的结构和电气特性,该存储器采用垂直浮栅通道,在110 nm半间距规则下具有4.5F/sup / 2/面积。利用增强电场进行擦除和编程,在100nA编程电流下,该单元的擦除时间< 1ms,编程时间< 10 /spl mu/s。这些结果证明了SuperFlash单元在高密度、高速应用中的持续可扩展性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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