{"title":"From FEOL Buildups to IC Chip: A Full Correlation of Galvanic Micro-Pitting on AlCu Pads","authors":"L. Sheng, Wei Pan, Zdenek Axman","doi":"10.1109/IIRW56459.2022.10032767","DOIUrl":null,"url":null,"abstract":"A full correlation of galvanic micro-pitting on AlCu pads has been for the first time revealed from FEOL buildups to IC chip. The presence of P-well was, in general, the primary factor of corrosion enhancement on specific pads. Therefore, the micro-pitting phenomenon should be more broadly examined well beyond the galvanic corrosion on individual pits. Furthermore, the electrons-limited electrochemical kinetics explain the pad-area dependence. This provides an excellent opportunity of design-for-reliability, where small pads can minimize the chance of micro-pitting occurrences.","PeriodicalId":446436,"journal":{"name":"2022 IEEE International Integrated Reliability Workshop (IIRW)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Integrated Reliability Workshop (IIRW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW56459.2022.10032767","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
A full correlation of galvanic micro-pitting on AlCu pads has been for the first time revealed from FEOL buildups to IC chip. The presence of P-well was, in general, the primary factor of corrosion enhancement on specific pads. Therefore, the micro-pitting phenomenon should be more broadly examined well beyond the galvanic corrosion on individual pits. Furthermore, the electrons-limited electrochemical kinetics explain the pad-area dependence. This provides an excellent opportunity of design-for-reliability, where small pads can minimize the chance of micro-pitting occurrences.
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