Gettering layer formation in low-dose SIMOX wafers

J. Jabłoński, M. Saito, M. Imai, S. Nakashima
{"title":"Gettering layer formation in low-dose SIMOX wafers","authors":"J. Jabłoński, M. Saito, M. Imai, S. Nakashima","doi":"10.1109/SOI.1995.526447","DOIUrl":null,"url":null,"abstract":"The mechanism of SFT generation in low-dose SIMOX wafers was analyzed. It was found that generation of these microdefects inside the top Si layer is strongly suppressed in comparison with those in the BOX. Moreover, both processes occur at different stages of high temperature annealing and thus can be controlled by the proper optimization of annealing conditions. As a result, it seems possible to produce SIMOX wafers with a defect-free top Si film and a gettering layer located beneath the BOX.","PeriodicalId":149490,"journal":{"name":"1995 IEEE International SOI Conference Proceedings","volume":"68 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1995 IEEE International SOI Conference Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.1995.526447","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

The mechanism of SFT generation in low-dose SIMOX wafers was analyzed. It was found that generation of these microdefects inside the top Si layer is strongly suppressed in comparison with those in the BOX. Moreover, both processes occur at different stages of high temperature annealing and thus can be controlled by the proper optimization of annealing conditions. As a result, it seems possible to produce SIMOX wafers with a defect-free top Si film and a gettering layer located beneath the BOX.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
低剂量SIMOX晶圆中吸积层的形成
分析了低剂量SIMOX硅片中SFT的产生机理。结果发现,与BOX中的微缺陷相比,这些微缺陷在顶部Si层内的产生受到了强烈的抑制。此外,这两种过程发生在高温退火的不同阶段,因此可以通过适当优化退火条件来控制。因此,似乎可以生产具有无缺陷的顶部Si膜和位于BOX下方的吸积层的SIMOX晶圆。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Analytical threshold voltage model for short channel n/sup +/-p/sup +/ double-gate SOI MOSFETs Front and back gate interface-trap generation due to hot carrier stress in fully depleted SOI/MOSFETs SOI material characterization using optical second harmonic generation Minimum parasitic resistance for ultra-thin SOI MOSFET with high-permittivity gate insulator performed by lateral contact structure Transient effects in floating body SOI NMOSFETs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1