L. Lin, J.Y. Chen, E. Chou, Y. Miura, S. Chang, J. Chiu
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引用次数: 0
Abstract
One new defect classification method called RDC (real-time defect classification) is used to manage killer defects in 300 mm DRAM production line after defect inspection by separating killer defects from all detected defects. Such method is proven to effectively monitor the trend of killer defects which help process engineer and integration engineer to enhance production yield by the watch of killer defect from RDC.
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