High speed performance of 0.35 /spl mu/m CMOS gates fabricated on low dose SIMOX substrates with/without N-well underneath the buried oxide layer

A. Yoshino, K. Kumagai, N. Hamatake, T. Tatsumi, H. Onishi, S. Kurosawa, K. Okumura
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Abstract

High speed performances of CMOS/SIMOX circuits have been demonstrated using the low dose SIMOX substrate in spite of the thin (80nm) buried oxide layer. The following two factors have been pointed out to understand the results: (i) the depletion layer which spreads underneath the buried oxide (BOX) layer, and (ii) the Vth-lowering in the PMOS transistor due to the negative back bias (VGB=-VDD) effect. However, the correlations between the high speed performance and these two factors have not been shown in detail. In this paper, we clarify the nature of the high speed performance of the fully depleted mode ultrathin CMOS/SIMOX gates fabricated on the low dose SIMOX substrate on the basis of our experimental results.
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在低剂量SIMOX衬底上制备的0.35 /spl mu/m CMOS栅极的高速性能
CMOS/SIMOX电路的高速性能已被证明使用低剂量的SIMOX衬底,尽管薄(80nm)埋氧化层。以下两个因素被指出来理解结果:(i)在埋藏氧化物(BOX)层下面扩散的耗尽层,以及(ii)由于负反偏置(VGB=-VDD)效应,PMOS晶体管中的vth降低。然而,高速性能与这两个因素之间的相关性尚未得到详细说明。本文在实验结果的基础上,阐明了在低剂量SIMOX衬底上制备的全耗尽模式超薄CMOS/SIMOX栅极的高速性能性质。
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