Molded Electronic Package Warpage Predictive Modelling Methodologies

K. Ong, W. K. Loh, R. Kulterman, Chih Chung Hsu, Jenn An Wang, H. Fu
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引用次数: 2

Abstract

Simulation tools such as FEA or CFD are widely employed to predict the thermal mechanical behavior of an electronic package based on the design and material attributes. Prediction accuracy and representation are highly dependent on the material model (visco-elastic, chemical shrinkage etc) and analysis approach especially for mold encapsulated packaging. In this paper, a basic evaluation was conducted using an arbitrary bi-material model to compare the material model of visco-elastic, time-temperature superposition shift factor and chemical shrinkage based on PVTC in both Moldex3D and FEA-A tools. The impact of visco-elastic constitutive property with temperature effects were included with a two steps shift factor model of Arrhenius and WLF functions. The implementation equations and analytical solutions are presented together with a detail discussion of the property model used. Transient heat transfer and structural analysis steps were incorporated to simulate the impact of visco-elastic property and shrinkage to the bi-material model.
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模压电子封装翘曲预测建模方法
FEA或CFD等仿真工具被广泛用于基于设计和材料属性来预测电子封装的热力学行为。预测精度和表征高度依赖于材料模型(粘弹性、化学收缩等)和分析方法,特别是模具封装包装。本文采用任意双材料模型对基于PVTC的粘弹性、时温叠加位移因子和化学收缩率的材料模型在Moldex3D和fea两种工具中进行了基本评价。采用Arrhenius函数和WLF函数的两步位移因子模型,考虑了温度对粘弹性本构性能的影响。给出了实现方程和解析解,并详细讨论了所使用的属性模型。采用瞬态传热和结构分析步骤模拟粘弹性和收缩对双材料模型的影响。
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