Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Abstract

The objective of this study is to quantify heat transfer direct cooling channel enhancements in single phase for optimal cooling. A device is created to mitigate hot spots in high voltage and high-power density electronics. This design study is for power modules with high heat fluxes specifically, SiC/Si-IGBT hybrid inverter systems requiring enhanced cooling. Experimental test for this heat sink device consists of flow loop tests through conventional hot plates with a first-generation heat sink device attached. This heat spreading device consists of an internal manifold design that is empirically correlated and simulated to help identify enhanced cooling techniques. Developing a framework of designing single nozzle manifolds to identify ideal angles of separation, nozzle chord lengths, and entrance/outlet region diameters for analysis of varying design layouts. Using computational fluid dynamics (CFD) to create an effective process that offers optimal geometry configurations for jet impinging heat sink devices. The present analysis investigates and defines parameters to predict design behaviors for optimal thermal performance of a localized cooling heat spreading device.