Implementation of a WLR-program into a production line

A. Papp, F. Bieringer, D. Koch, H. Kammer, A. Kohlhase, A. Lill, A. Preussger, A. Schlemm, M. Schneegans
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引用次数: 9

Abstract

Describes the implementation of a process reliability monitoring program on the basis of wafer level tests into the control concept of a production line. For the main reliability parameters-gate oxide integrity, hot carrier injection immunity and metallization stability against electromigration-the methods, test structures, test conditions and results are presented. Some examples for reliability improvement and the future targets of the WLR-program are given.
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在生产线上实施wlr程序
介绍了基于晶圆级测试的过程可靠性监控方案在生产线控制概念中的实施情况。介绍了栅极氧化物完整性、热载流子注入抗扰度和金属化抗电迁移稳定性等主要可靠性参数的测试方法、测试结构、测试条件和结果。给出了提高可靠性的一些实例和未来wlr计划的目标。
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