{"title":"New Adhesive Design and Evaluation for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration","authors":"S. Maetani, N. Araki, Y. Kim, S. Kodama, T. Ohba","doi":"10.23919/ICEP.2019.8733438","DOIUrl":null,"url":null,"abstract":"The material viscosities of permanent and temporary adhesives were examined using the rigid body pendulum method to reveal a suitable for the wafer bonding process at 100 °C. Properties suited for the debonding process The adhesive is applied to wafer-on-wafer (WOW) stacking with bumpless dual-damascene interconnect (via-last after bonding) technology, which enables multilevel stacking using ultra-thin wafers of several micrometers or less at low cost.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733438","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The material viscosities of permanent and temporary adhesives were examined using the rigid body pendulum method to reveal a suitable for the wafer bonding process at 100 °C. Properties suited for the debonding process The adhesive is applied to wafer-on-wafer (WOW) stacking with bumpless dual-damascene interconnect (via-last after bonding) technology, which enables multilevel stacking using ultra-thin wafers of several micrometers or less at low cost.
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