Detection and analysis of ESD-induced melt filaments for FSRAMs

M. Prud'homme, J. Miller
{"title":"Detection and analysis of ESD-induced melt filaments for FSRAMs","authors":"M. Prud'homme, J. Miller","doi":"10.1109/IRWS.1995.493594","DOIUrl":null,"url":null,"abstract":"Summary form only given. When evaluating a new manufacturing site, Fab A, it was discovered that SRAM devices were susceptible to failures induced by Human Body Model (HBM) Electrostatic Discharge (ESD). The worst case failures were observed for a positive zap with Vss referenced, with data (I/O) pins failing a 1.0 /spl mu/A output leakage criteria at zap voltages as low as 500 V. Similar SRAM devices from a different fab, Fab B, did not have this same sensitivity. To understand the sensitivity of Fab A material, the protection device for the I/O pins was analyzed.","PeriodicalId":355898,"journal":{"name":"IEEE 1995 International Integrated Reliability Workshop. Final Report","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 1995 International Integrated Reliability Workshop. Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1995.493594","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Summary form only given. When evaluating a new manufacturing site, Fab A, it was discovered that SRAM devices were susceptible to failures induced by Human Body Model (HBM) Electrostatic Discharge (ESD). The worst case failures were observed for a positive zap with Vss referenced, with data (I/O) pins failing a 1.0 /spl mu/A output leakage criteria at zap voltages as low as 500 V. Similar SRAM devices from a different fab, Fab B, did not have this same sensitivity. To understand the sensitivity of Fab A material, the protection device for the I/O pins was analyzed.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
fsram静电致熔丝的检测与分析
只提供摘要形式。在评估一个新的生产基地Fab a时,发现SRAM器件容易受到人体模型(HBM)静电放电(ESD)引起的故障。最坏的情况是在参考Vss的正电压下观察到,数据(I/O)引脚在电压低至500 V时无法达到1.0 /spl mu/ a输出泄漏标准。来自不同晶圆厂fab B的类似SRAM器件没有相同的灵敏度。为了了解Fab A材料的灵敏度,对I/O引脚保护装置进行了分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Particulate contamination control in plasma processing: building-in reliability for semiconductor fabrication Wafer level reliability procedures to monitor gate oxide quality using V ramp and J ramp test methodology Assessment of a unipolar pulsed ramp for the characterisation of MOS gate oxide reliability Migrated copper resistive shorts in plastic encapsulated devices A case study in a 100/spl times/reduction in sodium ions in a 0.8 /spl mu/m BiCMOS process using triangular voltage sweep
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1