{"title":"HIGH-DENSITY CMOS MULTICHIP-MODULE TESTING AND DIAGNOSIS","authors":"R.W. Bassett, P. S. Gillis, John J. Shushereba","doi":"10.1109/TEST.1991.519715","DOIUrl":null,"url":null,"abstract":"Muhichip-module ( M C M ) packages have been developed for use with high-density, high-performance CMOS chip technologies. The combination of CMOS and multichip packaging poses, new test-related challenges arising from the resulting v e 9 large circuit and signal inputloutput counts, and from CMOS-related reliability requirements. This paper discusses current practice and indicates jidture directions for MCM assembly, testing, and diagnosis.","PeriodicalId":272630,"journal":{"name":"1991, Proceedings. International Test Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1991, Proceedings. International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1991.519715","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19
Abstract
Muhichip-module ( M C M ) packages have been developed for use with high-density, high-performance CMOS chip technologies. The combination of CMOS and multichip packaging poses, new test-related challenges arising from the resulting v e 9 large circuit and signal inputloutput counts, and from CMOS-related reliability requirements. This paper discusses current practice and indicates jidture directions for MCM assembly, testing, and diagnosis.
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