Study of electron and hole injection statistics of BE-SONOS NAND Flash

H. Lue, T. Hsu, S. Lai, Yan-Ru Chen, Kuan-Fu Chen, C. Lo, I. Huang, T. Han, M. Chen, W. P. Lu, K. C. Chen, Chih-Shen Chang, M. Liaw, K. Hsieh, Chih-Yuan Lu
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引用次数: 7

Abstract

The electron and hole injection statistics of BE-SONOS NAND Flash is studied for the first time using a 75 nm charge-trapping NAND Flash test chip. By using the incremental step pulse programming (ISPP) method the impact of device variations are minimized and the electron number ( N ) fluctuation can be identified. We find that both electron and hole injection statistics well follow the Poisson statistics ( Sigma ∞ √N, where Sigma corresponds to the distribution width). However, due to the 3D fringing field effect the small transistors require more charge injection to obtain the same memory window, and this reduces the proportional factor of Sigma. We also found that the hole injection distribution is slightly broader than the electron injection, and can be explained by the lower charge centroid in nitride which leads to the larger proportional factor. Based on these results, we can also simulate the distribution for various technology nodes.
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BE-SONOS NAND闪存的电子和空穴注入统计研究
利用75 nm电荷捕获NAND闪存测试芯片,首次研究了BE-SONOS NAND闪存的电子和空穴注入统计数据。采用增量阶跃脉冲规划(ISPP)方法可以最小化器件变化的影响,并能识别电子数(N)波动。我们发现电子和空穴注入统计量都很好地遵循泊松统计量(Sigma∞√N,其中Sigma对应于分布宽度)。然而,由于三维边缘场效应,小晶体管需要更多的电荷注入来获得相同的存储窗口,这降低了Sigma的比例因子。我们还发现空穴注入分布比电子注入略宽,这可以解释为氮化物中较低的电荷质心导致了较大的比例因子。基于这些结果,我们还可以模拟各种技术节点的分布。
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