{"title":"Investigations on novel coaxial transmission line structures on MCM-L","authors":"A. Thiel, C. Habiger, G. Troster","doi":"10.1109/MCMC.1997.569343","DOIUrl":null,"url":null,"abstract":"This paper presents recent investigations on a novel transmission line structure with improved RF-performance and increased shielding capability based on MCM-L interconnect technology. Three key issues are addressed: Maximization of usable interconnect bandwidth, reproducibility of the characteristic electrical properties in large-volume production, and minimization of inter-signal and electromagnetic interference. Thanks to recent improvements of MCM-L technology this new structure is processable in a cost-effective roll-to-roll production cycle. The electrical properties of the new structure are deduced from the well-known coaxial and triplate transmission line models. Furthermore, FEM-simulation results provide an estimation of the limitations of the proposed structure, which are caused by conductor and dielectric losses. The design of a test-vehicle intended for verification of the simulation results is presented. And finally, measurement results obtained from TDR/TDT and VNA measurement setups are reported and compared to the theoretical estimations.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"208 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1997 IEEE Multi-Chip Module Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1997.569343","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper presents recent investigations on a novel transmission line structure with improved RF-performance and increased shielding capability based on MCM-L interconnect technology. Three key issues are addressed: Maximization of usable interconnect bandwidth, reproducibility of the characteristic electrical properties in large-volume production, and minimization of inter-signal and electromagnetic interference. Thanks to recent improvements of MCM-L technology this new structure is processable in a cost-effective roll-to-roll production cycle. The electrical properties of the new structure are deduced from the well-known coaxial and triplate transmission line models. Furthermore, FEM-simulation results provide an estimation of the limitations of the proposed structure, which are caused by conductor and dielectric losses. The design of a test-vehicle intended for verification of the simulation results is presented. And finally, measurement results obtained from TDR/TDT and VNA measurement setups are reported and compared to the theoretical estimations.