Hou-Jun Hsu, Jung-Tang Huang, Kuo-Yu Lee, R. Wu, T. Tsai
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引用次数: 2
Abstract
In this paper, we report a novel plating-friendly polishing mechanism for fabrication of high coplanarity and high density lead-free copper pillar bumps for advanced packaging applications. The final experimental results showed that the UIW (Uniformity in Wafer) could be sharply decreased from 6.37% after plating to 1.7% after polishing and even to 1.7% after reflow throughout the entire 4 inch wafer.
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