Nickel-phosphide contact for effective Schottky barrier modulation in black phosphorus p-channel transistors

Z. Ling, K. Majumdar, S. Sakar, S. Mathew, Juntao Zhu, K. Gopinadhan, T. Venkatesan, K. Ang
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Abstract

We demonstrate a new contact technology for realizing a near band edge contact Schottky barrier height (ΦB) in black phosphorus (BP) p-channel transistors. This is achieved via the use of high work function nickel (Ni) and thermal anneal to produce a novel nickel-phosphide (Ni2P) alloy which enables a record low hole ΦB of ~12 meV. The formation of reactive Ni2P/BP contact was found to further improve the transmission probability as compared to the Ni/BP contact. Moreover, the penetration of Ni2P in the source and drain regions could additionally reduce the parasitic series resistance, leading to drive current improvement.
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黑磷p沟道晶体管中有效肖特基势垒调制的磷化镍触点
我们展示了一种新的接触技术,用于在黑磷(BP) p通道晶体管中实现近带边接触肖特基势垒高度(ΦB)。这是通过使用高功函数镍(Ni)和热退火来生产一种新型磷化镍(Ni2P)合金来实现的,该合金可以实现创纪录的~12 meV的低空穴ΦB。与Ni/BP接触相比,反应性Ni2P/BP接触的形成进一步提高了透射率。此外,Ni2P在源极和漏极的渗透也可以降低寄生串联电阻,从而提高驱动电流。
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