Review of STT-MRAM circuit design strategies, and a 40-nm 1T-1MTJ 128Mb STT-MRAM design practice

H. Koike, T. Tanigawa, Toshinari Watanabe, T. Nasuno, Y. Noguchi, M. Yasuhira, T. Yoshiduka, Yitao Ma, H. Honjo, K. Nishioka, S. Miura, H. Inoue, S. Ikeda, T. Endoh
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引用次数: 3

Abstract

STT-MRAM is now an essential component for future low power consumption electronics. Recently, a number of STT-MRAM developments have been successively disclosed by major LSI vendors [1] –[9], and some of them announced that risk mass-production of STT-MRAM had started. This invited paper reviews, in this opportunity, STT-MRAM circuit design strategies, which cover memory cell design, sense amplifier (S/A) and reference generator (Refgen), and array architecture. Furthermore, as one example of STT-MRAM design, a 128Mb STT-MRAM chip using 40-nm standard CMOS and 3X-nm MTJ technology will be presented [10].
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回顾STT-MRAM电路设计策略,以及40nm 1T-1MTJ 128Mb STT-MRAM设计实践
STT-MRAM现在是未来低功耗电子产品的重要组件。最近,一些主要LSI厂商相继披露了STT-MRAM的发展[1]-[9],其中一些厂商宣布已经开始了STT-MRAM的风险量产。本文借此机会回顾了STT-MRAM电路设计策略,包括存储单元设计,感测放大器(S/A)和参考发生器(Refgen)以及阵列架构。此外,作为STT-MRAM设计的一个例子,将介绍使用40纳米标准CMOS和3X-nm MTJ技术的128Mb STT-MRAM芯片[10]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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