Heatsink design using spiral-fins considering additive manufacturing

Shingo Otake, Y. Tateishi, H. Gohara, R. Kato, Y. Ikeda, V. Parque, Muhammed Khairi Faiz, M. Yoshida, T. Miyashita
{"title":"Heatsink design using spiral-fins considering additive manufacturing","authors":"Shingo Otake, Y. Tateishi, H. Gohara, R. Kato, Y. Ikeda, V. Parque, Muhammed Khairi Faiz, M. Yoshida, T. Miyashita","doi":"10.23919/ICEP.2019.8733558","DOIUrl":null,"url":null,"abstract":"In recent years, there have been increasing the number of power modules which is required with high performance, miniaturization and weight saving. But these requires cause high heat generation density for power module, which gets junction operation temperature to rise. Cooling unit is thus greatly demanded for high heat dissipation. The simple shaped heatsinks (straight-fin type and pin fin type) were generally used. But they have the limit of cooling performance. In this report, we have developed new heatsink shape to cope with rapidly increasing of the cooling requirement. Cooling performance is shown to thermal resistance and pressure loss. We evaluated them by thermal fluid analysis. In this approach, the spiral-fin heatsink with spiral curved channels has excellent cooling performance. This shape is the unique point in this report. This is because the shape with three-dimensional regular curve has not been studied. The spiral-fin heatsink has many factors (fin thickness, fin pitch, the number of channels, etc.). These factors affect cooler performance. We changed these factors to determine the best shape of spiral-fin. As a result, the best shape is 14.9[%] lower than the straight-fin type in thermal resistance.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733558","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

In recent years, there have been increasing the number of power modules which is required with high performance, miniaturization and weight saving. But these requires cause high heat generation density for power module, which gets junction operation temperature to rise. Cooling unit is thus greatly demanded for high heat dissipation. The simple shaped heatsinks (straight-fin type and pin fin type) were generally used. But they have the limit of cooling performance. In this report, we have developed new heatsink shape to cope with rapidly increasing of the cooling requirement. Cooling performance is shown to thermal resistance and pressure loss. We evaluated them by thermal fluid analysis. In this approach, the spiral-fin heatsink with spiral curved channels has excellent cooling performance. This shape is the unique point in this report. This is because the shape with three-dimensional regular curve has not been studied. The spiral-fin heatsink has many factors (fin thickness, fin pitch, the number of channels, etc.). These factors affect cooler performance. We changed these factors to determine the best shape of spiral-fin. As a result, the best shape is 14.9[%] lower than the straight-fin type in thermal resistance.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
考虑增材制造的螺旋翅片散热器设计
近年来,对高性能、小型化和轻量化的要求越来越高,电源模块的数量也在不断增加。但这就要求功率模块的产热密度过高,导致结工作温度升高。因此,对冷却装置的高散热要求很大。一般采用形状简单的散热器(直鳍型和针鳍型)。但是它们的冷却性能是有限的。在本报告中,我们开发了新的散热器形状,以应对快速增长的冷却要求。冷却性能表现为热阻和压力损失。通过热流体分析对其进行了评价。在这种方法中,具有螺旋弯曲通道的螺旋翅片散热器具有良好的冷却性能。这个形状是这个报告的独特之处。这是因为具有三维规则曲线的形状尚未得到研究。螺旋翅片散热器有许多因素(翅片厚度、翅片间距、通道数量等)。这些因素影响冷却器的性能。我们通过改变这些因素来确定最佳的螺旋鳍形状。结果表明,最佳形状的热阻比直翅型低14.9%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
From Package to System Thermal Characterization and Design of High Power 2.5-D IC Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE Room-temperature printing of CNTs-based flexible TFTs with high performance Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments A novel TLP bonding based on sub-micron Ga particles
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1