Yield model for ASIC and processor chips

C. Stapper, J. Patrick, R. Rosner
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引用次数: 11

Abstract

Yield models based on chip area are inadequate for modeling the yield of CMOS ASIC and processor chips. A model based on the number of circuits was found to give more accurate results. Defect learning curves measured with DRAMs have been used successfully to project the yield of a wide variety of chips.
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用于ASIC和处理器芯片的良率模型
基于芯片面积的良率模型不足以模拟CMOS专用集成电路和处理器芯片的良率。基于电路数量的模型给出了更准确的结果。用dram测量的缺陷学习曲线已经成功地用于预测各种芯片的良率。
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The T9 transputer: A practical example of the application of standard test techniques Fault detection in sequential circuits through functional testing A highly testable 1-out-of-3 CMOS checker System level policies for fault tolerance issues in the FERMI project Topological optimization of PLAs for yield enhancement
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