A. Heryanto, Y. K. Lim, K. Pey, W. Liu, J.B. Tan, D. Sohn, L. Hsia
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引用次数: 0
Abstract
The effects of dielectric slots on Cu/Low-k interconnects reliability were studied. Dielectric slots were proven to be effective in suppressing stress-induced void failure but their impact on EM reliability was found to be minimal. Physical failure analysis and finite element simulations were used to explain the possible mechanisms associated to the different effects of dielectric slots on Cu/low-k reliability.
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