{"title":"Interconnect verification of multichip modules using boundary scan","authors":"David S. Karpenske","doi":"10.1109/VTEST.1991.208138","DOIUrl":null,"url":null,"abstract":"Certainly one of the key factors in the manufacture of multichip modules (MCM) is the verification and fault diagnosis of an MCM's structural interconnects. High performance MCM products, which are clearly an expensive technology, will incur additional costs unless appropriate diagnostic tools are made available for fast failure analysis during production test. Boundary scan implementation is key in making these tools feasible.<<ETX>>","PeriodicalId":157539,"journal":{"name":"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTEST.1991.208138","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Certainly one of the key factors in the manufacture of multichip modules (MCM) is the verification and fault diagnosis of an MCM's structural interconnects. High performance MCM products, which are clearly an expensive technology, will incur additional costs unless appropriate diagnostic tools are made available for fast failure analysis during production test. Boundary scan implementation is key in making these tools feasible.<>
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