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Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's最新文献

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At-speed testing of ASICs asic的高速测试
C. Gauthron
Testing ASICs 'at-speed' attempts to improve the test quality by detecting delay-faults. In this paper a methodology to generate at-speed test vectors is described. It is based on the comparison of simulation traces obtained within different timing conditions. The methodology has been automated and successfully used.<>
“高速”测试asic试图通过检测延迟故障来提高测试质量。本文描述了一种生成高速测试向量的方法。它是基于在不同时序条件下得到的仿真轨迹的比较。该方法已自动化并成功使用。
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引用次数: 3
Identification of structured automata for test evaluation 用于测试评估的结构化自动机识别
K. E. Maadani, J. Geffroy
Presents an original approach to the evaluation of test sequences applied to sequential circuits represented by structured-functional models; the method is based on formal identification of the internal modules of the circuit studied. A prototype software tool has been implemented in PROLOG in order to validate the approach.<>
提出了一种新颖的测试序列评估方法,应用于由结构-功能模型表示的顺序电路;该方法基于对所研究电路内部模块的形式化识别。为了验证该方法,在PROLOG中实现了一个原型软件工具。
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引用次数: 5
Comparison between the dynamic behavior of maximum length and cyclic shift registers 最大长度寄存器和循环移位寄存器动态特性的比较
R. Seireg, A. Vacroux
The study of the performance of maximum length and cyclic shift registers has been extended to broader classes of circuits. A new general form for the characteristic equation of the transition probability matrix was deduced which differs from equations obtained earlier.<>
对最大长度寄存器和循环移位寄存器性能的研究已经扩展到更广泛的电路类别。推导出了一种不同于以往的转移概率矩阵特征方程的新的一般形式。
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引用次数: 1
Testing the impact of process defects on ECL power-delay performance 测试工艺缺陷对ECL功率延迟性能的影响
Jiann-Shiun Yuan, J. Liou, David M. Wu
The impact of process defects on ECL power-delay product has been evaluated. The authors have developed the modeling equations including the process defects in the delay analysis. The delay equation provides the insight into the sensitivity of various process defects in ECL gate delay. The testing model equations are physics based and can be generalized to digital circuits other than ECL logic.<>
分析了工艺缺陷对ECL功率延迟产品的影响。作者建立了包含延迟分析过程缺陷的建模方程。该延迟方程提供了对各种工艺缺陷在ECL门延迟中的敏感性的洞察。测试模型方程是基于物理的,可以推广到除ECL逻辑以外的数字电路中。
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引用次数: 1
Using target faults to achieve a minimized partial scan path 利用目标故障实现局部扫描路径最小化
Harald Gundlach, Bernd K. Koch, K. Müller-Glaser
Today the most often applied DFT-strategy is full scan path. To reduce its overhead a partial scan path can be selected. For minimizing the size of the partial scan path existing testpatterns are used which will detect a part of the faults. Only the remaining faults, so called target faults, have to be addressed using partial scan. Different methods are given to adapt a partial scan path to the target faults. They do not depend on ATPG and therefore have very short runtimes. Results on sequential ATPG-benchmarks show that a strong reduction in the size of the partial scan path is possible. Also the combination of the structural selection and the selection with respect to target faults is proposed. First results prove its effectiveness.<>
目前最常用的dft策略是全扫描路径。为了减少开销,可以选择部分扫描路径。为了最小化部分扫描路径的大小,使用现有的测试模式来检测部分故障。只有剩余的故障,即所谓的目标故障,必须使用部分扫描来解决。给出了不同的方法来适应局部扫描路径的目标故障。它们不依赖于ATPG,因此运行时间非常短。连续atpg基准测试的结果表明,部分扫描路径的大小可能会大大减少。提出了构造选择与目标断层选择相结合的方法。初步结果证明了该方法的有效性。
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引用次数: 2
Statistical sensitivity simulation for integrating design and testing of MOSFET integrated circuits 统计灵敏度仿真用于MOSFET集成电路的集成设计与测试
W. Wong, J. Liou, Jiann-Shiun Yuan, David M. Wu
A computer-aided design tool for testing MOSFET integrated circuit performance as functions of MOSFET channel length and channel width variations is presented. The numerical model, which is developed based on the Tellegen's theorem and a database that contains the statistical information of MOSFET process parameters, is implemented in SPICE2 circuit simulator. Sensitivity simulation of a MOSFET operational amplifier is carried out to illustrate the usefulness of the present work.<>
提出了一种测试MOSFET集成电路性能随MOSFET沟道长度和沟道宽度变化的计算机辅助设计工具。基于Tellegen定理和包含MOSFET工艺参数统计信息的数据库建立了该数值模型,并在SPICE2电路模拟器中实现。对一个MOSFET运算放大器进行了灵敏度仿真,以说明本文工作的有效性。
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引用次数: 0
Modeling the effects of imperfect production testing on reconfigurable VLSI chips 模拟不完善的生产测试对可重构VLSI芯片的影响
B. Ciciani
An innovative method for the 'apparent' yield evaluation is presented. By this method it is possible to evaluate the quality of the manufacturing process and the expected fraction of truly good chips at the end of the testing and reconfiguration phase. It permits the characterization of fault-tolerant VLSI chips (or WSI systems) with and without redundancy. It is easy to use and permits the predictability of the approximation level of the yield values.<>
提出了一种新的“表观”良率评价方法。通过这种方法,可以在测试和重新配置阶段结束时评估制造过程的质量和真正好芯片的预期比例。它允许具有和不具有冗余的容错VLSI芯片(或WSI系统)的表征。它易于使用,并且允许对收益率值的近似水平进行预测
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引用次数: 0
Guardbanding VLSI EEPROM test programs 护带VLSI EEPROM测试程序
D. Sweetman
The test and guardband philosophy is essential in the manufacturing of integrated circuits. The philosophy integrates the general rules for test sequences, hardware, and software. The data sheet and philosophy determine the values and methodology for parameter and functional tests. Guardbanding is the off-setting of a test parameter, condition, or attribute acceptance level from the specified value. Variability in equipment and device performance necessitate machine guardbands. Device and test program guardbands improve test productivity. Changing the applied, measured, or external conditions from those specified implements the guardbands for attribute testing. The author addresses the use of guardbands for an MOS VLSI EEPROM, i.e. a nonvolatile reprogrammable memory.<>
测试和保护带的理念在集成电路的制造中是必不可少的。该理念集成了测试序列、硬件和软件的一般规则。数据表和原理决定了参数和功能测试的值和方法。守卫带是测试参数、条件或属性接受级别与指定值的偏移。设备和设备性能的可变性需要机器防护带。设备和测试程序保护带提高了测试效率。改变那些指定的应用的、测量的或外部条件,实现属性测试的保护带。作者解决了MOS VLSI EEPROM的保护带的使用,即非易失性可重新编程存储器。
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引用次数: 3
A software system architecture for testing multiple part number wafers 用于测试多零件号晶圆的软件系统架构
R. M. Smyczynski, K. Brennan
Testing single part number wafers is the normal mode of testing semiconductor devices in the industry today. However, as wafers get larger it may become more economical to put different devices on the same wafer resulting in multiple part number wafers. The authors describe a system architecture that allows for the testing of such wafers.<>
测试单个零件号晶圆是当今工业中测试半导体器件的正常模式。然而,随着晶圆越来越大,在同一晶圆上放置不同的设备可能会变得更加经济,从而产生多个零件编号的晶圆。作者描述了一种允许测试这种晶圆的系统架构。
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引用次数: 0
An analysis and testing of operation induced faults in MOS VLSI MOS VLSI中操作诱发故障的分析与测试
R. Rajsuman, A. Jayasumana, Y. Malaiya, Juney Park
The operation induced faults in CMOS circuits are discussed. The significance of these faults for high density, small geometry circuits is pointed out. For modeling purposes the effects of these faults are correlated with classical fault models. A conductance fault model is presented to incorporate these faults. A test scheme to detect these faults is suggested which is based on the measurement of supply current. A scheme to generate test patterns for these faults is also outlined.<>
讨论了CMOS电路中的操作诱发故障。指出了这些故障对高密度小几何电路的意义。为了建模的目的,这些断层的影响与经典断层模型相关联。提出了一个包含这些故障的电导故障模型。提出了一种基于电源电流测量的故障检测方案。本文还概述了为这些故障生成测试模式的方案。
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引用次数: 4
期刊
Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's
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