InGaAs-GaAs Strained Layer Quantum Well Buried Heterostructure Lasers (λ> 1 μm) by Metalorganic Chemical Vapor Deposition

P. York, K. Beernink, G. E. Fernández, J. Coleman
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引用次数: 74

Abstract

The buried heterostructure (BH) laser1 is one of the most attractive index guided stripe geometry semiconductor lasers because of the combination of strong lateral index guiding and absolute current confinement provided by a heterostructure discontinuity in the lateral direction. This structure is difficult to fabricate, however, because of the need for processing high quality narrow stripe etched mesas with a high quality regrowth interface at the edges of the active region. The regrowth is especially difficult2 for AlGaAs-GaAs BH lasers having higher aluminum composition confining layers. Various1,3-8 AlGaAs-GaAs BH laser structures have been reported. In this work, we report the characteristics of long wavelength (λ> 1 μm) strained layer InGaAs-GaAs-AlGaAs quantum well buried heterostructure lasers9-11 formed by wet chemical etching and a two-step MOCVD growth process. The relatively low aluminum composition of the confining layers allows for high quality regrowth interfaces and effective use2,12 of a silicon dioxide mask for selective epitaxy limited to the etched regions. The structures reported here have active region stripe widths of ~3.5 μm, an emission wavelength of λ ~ 1.074 μm, and threshold currents of less than 7 mA (cavity length 405 μm). Output powers in excess of 130 mW per uncoated facet with total differential quantum efficiencies of greater than 60% have been observed. Near-field patterns indicate that the lasers are operating on a fundamental lateral mode and are stable to more than thirty times laser threshold.
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金属有机化学气相沉积制备InGaAs-GaAs应变层量子阱埋异质结构激光器(λ> 1 μm
埋地异质结构(BH)激光器是一种极具吸引力的折射率引导条形半导体激光器,因为它具有很强的横向折射率引导和横向不连续性所提供的绝对电流约束。然而,这种结构很难制造,因为需要加工高质量的窄条纹蚀刻台面,并且在活性区域的边缘有高质量的再生界面。对于具有较高铝成分约束层的AlGaAs-GaAs BH激光器,再生尤为困难。各种1,3-8 AlGaAs-GaAs BH激光结构已被报道。在这项工作中,我们报道了长波(λ> 1 μm)应变层InGaAs-GaAs-AlGaAs量子阱埋异质结构激光器9-11的特性,该激光器是由湿化学蚀刻和两步MOCVD生长工艺形成的。限制层的相对低铝成分允许高质量的再生界面和有效地使用2,12二氧化硅掩膜用于仅限于蚀刻区域的选择性外延。该结构的活性区条纹宽度为~3.5 μm,发射波长为λ ~ 1.074 μm,阈值电流小于7 mA(腔长405 μm)。已观察到每个未涂覆面的输出功率超过130兆瓦,总微分量子效率大于60%。近场模式表明,激光器工作在一个基本的横向模式,并稳定在三十倍以上的激光阈值。
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