{"title":"Effects of Thermal Boundary Resistance on the Thermal Performance of GaN HEMT on Diamond","authors":"A. Helou, M. Tadjer, K. Hobart, P. Raad","doi":"10.1109/IRPS45951.2020.9128806","DOIUrl":null,"url":null,"abstract":"GaN high power devices experience substantial self-heating that drives operation temperatures beyond a safe and reliable limit, which has led to the consideration of high conductivity substrates. This study presents a coupled experimental and numerical investigation of the effectiveness of CVD-Diamond as a substrate for GaN HEMTs. The study uses a novel that optimizes a thermal model using an experimentally observed thermal response. The model is then used to assess the effect of the GaN-Di interface on the thermal response of GaN-Di HEMTs, which would serve as a guideline for future developments in GaN and Di growth.","PeriodicalId":116002,"journal":{"name":"2020 IEEE International Reliability Physics Symposium (IRPS)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS45951.2020.9128806","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
GaN high power devices experience substantial self-heating that drives operation temperatures beyond a safe and reliable limit, which has led to the consideration of high conductivity substrates. This study presents a coupled experimental and numerical investigation of the effectiveness of CVD-Diamond as a substrate for GaN HEMTs. The study uses a novel that optimizes a thermal model using an experimentally observed thermal response. The model is then used to assess the effect of the GaN-Di interface on the thermal response of GaN-Di HEMTs, which would serve as a guideline for future developments in GaN and Di growth.