Fault Isolation Approaches for Nanoscale TSV Interconnects in 3D Heterogenous Integration

Abstract

We report optical and electron beam-based fault isolation approaches for short and open defects in nanometer scale through silicon via (TSV) interconnects (180×250 nm, 500 nm height). Short defects are localized by photon emission microscopy (PEM) and optical beam-induced current (OBIC) techniques, and open defects are isolated by active voltage contrast imaging in the scanning electron microscope (SEM). We confirm our results by transmission electron microscopy (TEM) based cross sectioning.