High Aspect Ratio, Vertical Bipolar Junction Transistor NPN Device Fault Isolation & Analysis Techniques

Kevin A. Distelhurst, Dan Bader
{"title":"High Aspect Ratio, Vertical Bipolar Junction Transistor NPN Device Fault Isolation & Analysis Techniques","authors":"Kevin A. Distelhurst, Dan Bader","doi":"10.31399/asm.cp.istfa2021p0053","DOIUrl":null,"url":null,"abstract":"\n Analog components are still an important aspect of our society's electronic portfolio. They play a role in the emerging and expanding 5G electronic industry, for instance. The NPN bipolar junction transistor (BJT) is the foundation of many analog circuits and has continually evolved to meet more demanding specifications [1], [2]. Certain embodiments of these NPNs pose difficulties in failure analysis. One such embodiment is a vertical NPN BJT with high aspect ratio dimensions. Specifically, the dimensions involved are nanometer thick NP & PN junctions that extend microns in length. These dimensions provide desired performance improvements but a subtle, nanometer scale defect present anywhere along this length can cause substantial electrical shifts detrimental to an analog circuit. Several simple and complex techniques using common failure analysis tools can isolate these defects as discussed in this paper.","PeriodicalId":188323,"journal":{"name":"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.istfa2021p0053","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Analog components are still an important aspect of our society's electronic portfolio. They play a role in the emerging and expanding 5G electronic industry, for instance. The NPN bipolar junction transistor (BJT) is the foundation of many analog circuits and has continually evolved to meet more demanding specifications [1], [2]. Certain embodiments of these NPNs pose difficulties in failure analysis. One such embodiment is a vertical NPN BJT with high aspect ratio dimensions. Specifically, the dimensions involved are nanometer thick NP & PN junctions that extend microns in length. These dimensions provide desired performance improvements but a subtle, nanometer scale defect present anywhere along this length can cause substantial electrical shifts detrimental to an analog circuit. Several simple and complex techniques using common failure analysis tools can isolate these defects as discussed in this paper.
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高纵横比、垂直双极结晶体管NPN器件故障隔离与分析技术
模拟元件仍然是我们社会电子产品组合的一个重要方面。例如,它们在新兴和不断扩大的5G电子产业中发挥着作用。NPN双极结晶体管(BJT)是许多模拟电路的基础,并不断发展以满足更苛刻的规格[1],[2]。这些npn的某些实施例给失效分析带来困难。一个这样的实施例是具有高纵横比尺寸的垂直NPN BJT。具体来说,所涉及的尺寸是纳米厚度的NP和PN结,其长度延伸到微米级。这些尺寸提供了期望的性能改进,但是沿着这个长度存在的细微的纳米级缺陷会导致对模拟电路有害的实质性电位移。一些简单和复杂的技术使用常见的故障分析工具可以隔离这些缺陷,如本文所讨论的。
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