A novel thermal-aware structure of TSV cluster

2015 28th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2015-09-01 DOI:10.1109/SOCC.2015.7406993

Jingyan Fu, L. Hou, Jinhui Wang, Bo Lu, Wei Zhao, Yang Yang

引用次数: 3

Abstract

Although thermal-aware TSV (Through Silicon Via) cluster's behavior has been studied extensively, the structure of TSV cluster, which is also important to thermal problem in 3D IC (Three Dimensional Integrate Circuit), is ignored. In this paper, a novel structure of TSV cluster is proposed to improve the thermal performance of 3D IC. Models have been established to study the effect of TSV cluster's structure on thermal performance in 3D IC. Simulation results show that the proposed TSV cluster's structure improves the thermal performance of 3D IC, which can help to alleviate the thermal problem.

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一种新的TSV团簇热感知结构

虽然热感知TSV (Through Silicon Via)簇的行为已经被广泛研究，但TSV簇的结构却被忽视了，而TSV簇的结构对三维集成电路的热问题也很重要。本文提出了一种新的TSV簇结构来改善3D集成电路的热性能，并建立了模型来研究TSV簇结构对3D集成电路热性能的影响。仿真结果表明，TSV簇结构改善了3D集成电路的热性能，有助于缓解热问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2015 28th IEEE International System-on-Chip Conference (SOCC)

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