Nicolas Courjault, Fulvia Infante, V. Bley, T. Lebey, P. Perdu
{"title":"Improvement of 3D current mapping by coupling magnetic microscopy and X-Ray computed tomography","authors":"Nicolas Courjault, Fulvia Infante, V. Bley, T. Lebey, P. Perdu","doi":"10.1109/IPFA.2014.6898141","DOIUrl":null,"url":null,"abstract":"Magnetic Microscopy has demonstrated all its functionality for 2D component thanks to its ability to image current density distribution from magnetic field. At the “More than Moore” age, we need to improve our capabilities to detect and localize failure in 3D components. Unfortunately, it is not possible to directly image 3D current density from a magnetic field scan. 3D conductive path information, that could come from design, and failure assumptions are also needed. In this paper, a new approach based on X-Ray Computed Tomography that bypasses the need of design information and failure site assumptions is presented and its results are discussed.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898141","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Magnetic Microscopy has demonstrated all its functionality for 2D component thanks to its ability to image current density distribution from magnetic field. At the “More than Moore” age, we need to improve our capabilities to detect and localize failure in 3D components. Unfortunately, it is not possible to directly image 3D current density from a magnetic field scan. 3D conductive path information, that could come from design, and failure assumptions are also needed. In this paper, a new approach based on X-Ray Computed Tomography that bypasses the need of design information and failure site assumptions is presented and its results are discussed.