Revealing the high room and low temperature mobilities of 2D holes in a strained Ge quantum well heterostructures grown on a standard Si(001) substrate

M. Myronov, C. Morrison, J. Halpin, S. Rhead, J. Foronda, D. Leadley
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引用次数: 5

Abstract

We report an extremely high 2DHG mobility of 4500 cm2V-1s-1 and 777000 cm2V-1s-1 at 293 and 0.333 K, respectively, in a compressively strained Ge QW grown by industrial type RP-CVD on a standard Si(001) substrate. The obtained 2DHG mobility is substantially higher than those reported so far and in structures grown by research type epitaxial growth techniques, i.e. SS-MBE and LEPE-CVD. Also, the room and low temperature hole mobilities obtained are the highest not only among the group-IV Si and Ge based semiconductors, but also among p-type III-V and II-VI ones. These results demonstrate the very high quality of the strained Ge QW epilayers grown by RP-CVD and the huge potential for further applications of such materials in modern and future CMOS, p-MOSFET and p-MODFET electronic devices. The 2DHG mobility is already sufficiently high to fabricate sub-100 nm electronic devices and demonstrate ballistic transport therein at or around room temperature.
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揭示了在标准Si(001)衬底上生长的应变Ge量子阱异质结构中二维空穴的高室温和低温迁移率
在标准Si(001)衬底上通过工业型RP-CVD生长的压缩应变Ge QW中,在293 K和0.333 K下,2DHG迁移率分别为4500 cm2V-1s-1和777000 cm2V-1s-1。所获得的2DHG迁移率大大高于迄今为止报道的,并且在研究型外延生长技术(即SS-MBE和LEPE-CVD)中生长的结构中。得到的室温和低温空穴迁移率不仅在iv族Si和Ge基半导体中最高,而且在III-V和II-VI型半导体中也最高。这些结果证明了RP-CVD生长的应变Ge QW薄膜的高质量,以及这种材料在现代和未来CMOS, p-MOSFET和p-MODFET电子器件中的进一步应用的巨大潜力。2DHG的迁移率已经足够高,可以制造低于100纳米的电子器件,并在室温或室温附近演示其中的弹道传输。
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