Achieving stretched capacity goal through integrated engineering and manufacturing excellence

Abstract

Achieving stretched equipment capacity and high productivity in high volume manufacturing is a gritty challenge to drive down cost continuously in this competitive chipset market. With unprecedented volume ramp of both key products in Q4'99, the Test Module faced a shortage of two to four testers. Driving through working group, a refurbishment process was achieved successfully resulting in 60% reduction of tester faults thus improving mean time between failure (MTBF) from 140 hrs to 160 hrs. With the implementation of improved pogo pins at Tester Interface Unit (TIU) and test head had improved cleaning frequency from 5 k to 90 k, one-sum test yield from 88.7% to 97.5% and reduced non-genuine SBL from 10% to less than 3% consistently.