{"title":"Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique","authors":"F. K. Yong","doi":"10.1109/IPFA.2014.6898172","DOIUrl":null,"url":null,"abstract":"The paper shares the application of electron diffraction spot indexing to identify intermetallic phases in copper wire bond. Standard Scanning Transmission Electron Microscopy (STEM) technique with a converged electron probe was modified to produce parallel nano beam for forming electron diffraction spot patterns, CuAl(η2)and CuAl2(θ) phases in copper wire bond were identified by indexing the diffraction spots.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898172","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The paper shares the application of electron diffraction spot indexing to identify intermetallic phases in copper wire bond. Standard Scanning Transmission Electron Microscopy (STEM) technique with a converged electron probe was modified to produce parallel nano beam for forming electron diffraction spot patterns, CuAl(η2)and CuAl2(θ) phases in copper wire bond were identified by indexing the diffraction spots.
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