Built-in-self-test considerations in a high-performance, general-purpose processor

S. Sarma
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Abstract

The intent of this paper is to describe the built-in-self-test (BIST) design and verification methodology followed for thermal conduction modules (TCMs) in the aircooled IBM Enterprise System/9000 Type 9121 processors. The ES/9121 processor utilizes a mixture of bipolar and CMOS circuitry. Each ES/9121 processor TCM can accommodate a maximum of 121 logic and memory chips. There are five distinct TCMs in the uniprocessor configuration and the testability results achieved using BIST will be presented in this paper. The resources required to support the BIST process will also be presented. Finally, improvements to the BIST methodology will be discussed.
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高性能通用处理器中的内置自检注意事项
本文的目的是描述风冷IBM企业系统/9000型9121处理器中的热传导模块(tcm)的内置自测(BIST)设计和验证方法。ES/9121处理器采用双极和CMOS电路的混合。每个ES/9121处理器TCM最多可容纳121个逻辑和存储芯片。在单处理器配置中有五种不同的tcm,本文将介绍使用BIST获得的可测试性结果。还将介绍支持BIST过程所需的资源。最后,将讨论改进的BIST方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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