ESD protection in deep submicron CMOS technology -- Does the transient matter?

K. Cheung, A. Kamgar
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引用次数: 2

Abstract

Common ESD protection devices have a snap-back characteristic similar to a siliconcontrol-rectifier. The transient voltage required to trigger these devices usually is not an important design criterion as long as it is not too high. We show that when gate-oxide is thin, this voltage transient creates far more defects in the gate-oxide than the main ESD event clamped at the holding voltage. Due to difficulty in measurement, this oxide reliability degradation can lead to chip failure but not show up in simulated ESD test.
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深亚微米CMOS技术中的ESD保护——瞬态问题重要吗?
常见的ESD保护器件具有类似于硅控整流器的回跳特性。触发这些器件所需的瞬态电压只要不太高,通常不是一个重要的设计标准。我们表明,当栅极氧化物很薄时,这种电压瞬态在栅极氧化物中产生的缺陷远远超过在保持电压下箝位的主ESD事件。由于测量困难,这种氧化物可靠性下降可能导致芯片失效,但不会在模拟ESD测试中出现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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