{"title":"An advanced version of the electrically programmable hybrid-WSI substrate","authors":"H. Stopper","doi":"10.1109/ICWSI.1993.255249","DOIUrl":null,"url":null,"abstract":"The electrically programmable interconnection wafer for hybrid wafer scale integration (WSI) or multichip modules (MCMs) depends on three key constituents, which are the antifuse, the thin-film transmission line, and the architecture. Their impact on device performance is explored, and their parametric improvements from early to present and potential future devices are appraised.<<ETX>>","PeriodicalId":377227,"journal":{"name":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1993.255249","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The electrically programmable interconnection wafer for hybrid wafer scale integration (WSI) or multichip modules (MCMs) depends on three key constituents, which are the antifuse, the thin-film transmission line, and the architecture. Their impact on device performance is explored, and their parametric improvements from early to present and potential future devices are appraised.<>
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