Hong Wang, G. Ng, S. Mcalister, R. Driad, R. Mckinnon
{"title":"Hot-carrier induced degradation in InP/InGaAs/InP double heterojunction bipolar transistors","authors":"Hong Wang, G. Ng, S. Mcalister, R. Driad, R. Mckinnon","doi":"10.1109/ICIPRM.1999.773729","DOIUrl":null,"url":null,"abstract":"In this paper, bias stress tests and hot carrier induced degradation behavior in InP/InGaAs/InP double heterojunction bipolar transistors are reported. We have found that an unrecoverable increase of emitter-collector reverse current (I/sub CEO/) occurs during reverse-bias B-C junction stress, which is mainly due to the increase of the B-C junction leakage current. Furthermore, the hot carrier induced damage during the B-C bias stress does not only occur at the B-C junction but also at the B-E junction region. This subsequently causes the degradation of the device current gain (/spl beta/). We also show the dependence of the device degradation on different stress bias voltages.","PeriodicalId":213868,"journal":{"name":"Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIPRM.1999.773729","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
In this paper, bias stress tests and hot carrier induced degradation behavior in InP/InGaAs/InP double heterojunction bipolar transistors are reported. We have found that an unrecoverable increase of emitter-collector reverse current (I/sub CEO/) occurs during reverse-bias B-C junction stress, which is mainly due to the increase of the B-C junction leakage current. Furthermore, the hot carrier induced damage during the B-C bias stress does not only occur at the B-C junction but also at the B-E junction region. This subsequently causes the degradation of the device current gain (/spl beta/). We also show the dependence of the device degradation on different stress bias voltages.