CoOx-RRAM memory cell technology using recess structure for 128Kbits memory array

S. Kawabata, Mitsuru Nakura, S. Yamazaki, T. Shibuya, Y. Inoue, Junya Onishi, Yoshiaki Tabuchi, Y. Tamai, Y. Yaoi, K. Ishihara, Y. Ohta, H. Shima, H. Akinaga, Natsuki Fukuda, Hidenao Kurihara, Yoshiaki Yoshida, Y. Kokaze, Y. Nishioka, K. Suu, K. Nakayama, A. Kitagawa, S. Ohnishi, N. Awaya
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引用次数: 6

Abstract

This paper presents the process integration and device technology for the Resistance RAM(RRAM) memory array using a CoOx film and a recess structure as a resistor, which is capable of low voltage, high speed and low current operation. The resistance of the CoOx film and its uniformity are strongly dependent on the film quality, which is optimized by controlling the O2 gas flow rate during the film deposition. We demonstrate the basic write and read operation of the 128Kbits memory array by developing the novel process integration technology and optimizing the test algorism.
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CoOx-RRAM存储单元技术采用凹槽结构为128Kbits存储阵列
本文介绍了采用CoOx薄膜和凹槽结构作为电阻器的电阻存储器阵列的工艺集成和器件技术,实现了低电压、高速度和低电流的工作。CoOx膜的阻力和均匀性与膜质量密切相关,膜质量可通过控制膜沉积过程中氧气流速来优化。通过开发新的过程集成技术和优化测试算法,我们演示了128Kbits存储阵列的基本读写操作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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