Russell McCabe, R. Chaudhuri, S. Spangler, Russ Heller, A. Tahraoui, Emmett Synder, W. Simpson, Michael Frachel, Glen Martin
{"title":"Root Cause Identification and Mitigation of Polysilicon CMP Underpolish Increase in DRAM Manufacturing","authors":"Russell McCabe, R. Chaudhuri, S. Spangler, Russ Heller, A. Tahraoui, Emmett Synder, W. Simpson, Michael Frachel, Glen Martin","doi":"10.1109/asmc54647.2022.9792484","DOIUrl":null,"url":null,"abstract":"A systematic approach for root cause identification and mitigation of poly CMP underpolish increase in high volume manufacturing is presented. Different aspects of product quality and yield enhancement has been highlighted utilizing appropriate inline metrology and wafer probe data.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"8 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792484","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A systematic approach for root cause identification and mitigation of poly CMP underpolish increase in high volume manufacturing is presented. Different aspects of product quality and yield enhancement has been highlighted utilizing appropriate inline metrology and wafer probe data.
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