{"title":"Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips","authors":"Weishen Chu, Laura Spinella, D. Shirley, P. Ho","doi":"10.1109/IRPS45951.2020.9128333","DOIUrl":null,"url":null,"abstract":"Effects of wiring density and Cu pillar structure, two key features for advanced Cu low-k chips, on chip package interaction (CPI) were investigated. A multi-level finite element analysis (FEA) model was developed to evaluate the effects on CPI based on the energy release rate driving delamination. The effect of wiring density in low-k dielectric layers and the interaction effect between intermetallic compound and wiring design were quantified to assess CPI reliability.","PeriodicalId":116002,"journal":{"name":"2020 IEEE International Reliability Physics Symposium (IRPS)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS45951.2020.9128333","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
Effects of wiring density and Cu pillar structure, two key features for advanced Cu low-k chips, on chip package interaction (CPI) were investigated. A multi-level finite element analysis (FEA) model was developed to evaluate the effects on CPI based on the energy release rate driving delamination. The effect of wiring density in low-k dielectric layers and the interaction effect between intermetallic compound and wiring design were quantified to assess CPI reliability.
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