Intrinsic area array ICs: what, why, and how

Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI:10.1109/MCMC.1997.569355

P. Dehkordi, C. Tan, D. Bouldin

引用次数: 9

Abstract

Area-array bonding technology (i.e. flip-chip, C4) was pioneered by IBM in the late 1960's as an alternative to periphery bonding technology (i.e. wire-bond). In recent years, several commercial companies have started offering bumping and flip-chip services. Flip-chip technology is expected to grow at at compound annual growth rate of 38% through the year 2001. The purpose of this paper is to address the IC design issues and alternatives that are presently being used for area-array bonding technology and show the impact of these design issues at the system level.

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内禀面积阵列ic:什么，为什么，以及如何

区域阵列键合技术(即倒装芯片，C4)是由IBM在20世纪60年代后期开创的，作为外围键合技术(即线键合)的替代方案。近年来，一些商业公司已经开始提供碰撞和倒装芯片服务。到2001年，倒装芯片技术预计将以38%的复合年增长率增长。本文的目的是解决目前用于区域阵列键合技术的IC设计问题和替代方案，并展示这些设计问题在系统级的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 1997 IEEE Multi-Chip Module Conference

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