Thermal Analysis and Design of a Ka-Band Power Amplifier in 130 nm SiGe BiCMOS

Alexander Haag, M. Kaynak, A. Ulusoy
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Abstract

This paper presents the design and thermal challenges of large-scale silicon-based power amplifiers (PAs). As an example, a Ka-Band PA in 130 nm silicon germanium (SiGe) BiCMOS with an aluminum back end of line (BEOL) is presented. It is a pseudo differential transformer-based design featuring efficient 2:1 transformers for a high impedance transformation ratio. The PA achieves Psat of 23.2 dBm at 26 % power added efficiency (PAE). Differing results due to on-chip thermal effects are presented and discussed in this paper.
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130 nm SiGe BiCMOS ka波段功率放大器的热分析与设计
本文介绍了大规模硅基功率放大器(PAs)的设计和热挑战。作为一个例子,提出了一种采用铝后端线(BEOL)的130 nm硅锗(SiGe) BiCMOS的ka波段PA。它是一种基于伪差分变压器的设计,具有高效的2:1变压器,具有高阻抗转换比。PA在26%的功率附加效率(PAE)下实现23.2 dBm的Psat。本文提出并讨论了由于片上热效应而产生的不同结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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