Comparison of Low Temperature Sinterability of Silver Micro-particles in Epoxy-based Binders Containing Several Mercaptocarboxylates

Abstract

Epoxy-based electrically conductive pastes containing silver micro-fillers composed with several types of mercaptocarboxylates were prepared. Although low temperature sintering of silver micro-fillers could be successfully promoted within the epoxy-based binder, their electrical resistivity was quite different depending on molecular structure of the mercaptocarboxylates. The functional groups of this reagent play an important role to enhance surface diffusion of silver. However, necking of the silver fillers was insufficiently induced when the reagents that have relatively high decomposition temperature was used as a constituent of the binder. Molecular design of the promoters is essential to induce low temperature sintering of silver micro-fillers within polymer-based binders.