Analysis, design and implementation of mm-Wave SiGe stacked Class-E power amplifiers

K. Datta, J. Roderick, H. Hashemi
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引用次数: 20

Abstract

Design equations and performance limits of stacked Class-E power amplifiers at mm-waves, including the limitations imposed by device parasitics, are presented in this paper. As a proof of concept of this parasitic aware mm-wave Class-E design methodology and to demonstrate the beyond BVCEO Class-E operation in a stacked architecture at mm-wave frequencies, a Q-band, single ended, two-stage, double-stacked, Class-E power amplifier is designed in a 0.13 μm SiGe HBT BiCMOS process. The measured performance of the fabricated chip show 23.4 dBm maximum output power at 34.9% peak power added efficiency (PAE), and 14.6 dB of power gain across 5 GHz centered around 41 GHz for a supply voltage of 4 V. The total chip area including the pads is 0.8 mm × 1.28 mm.
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毫米波SiGe堆叠e类功率放大器的分析、设计与实现
本文给出了堆叠型e类功率放大器在毫米波下的设计方程和性能限制,包括器件寄生的限制。为了验证这种寄生感知毫米波e类设计方法的概念,并演示在毫米波频率下堆叠架构下的超越BVCEO e类操作,我们设计了一个q波段、单端、两级、双堆叠的e类功率放大器,采用0.13 μm SiGe HBT BiCMOS工艺。该芯片在峰值功率增加效率(PAE)为34.9%时的最大输出功率为23.4 dBm,在4 V电源电压下,以41 GHz为中心的5 GHz范围内的功率增益为14.6 dB。包括焊盘在内的总芯片面积为0.8 mm × 1.28 mm。
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