N. Zagni, A. Chini, F. Puglisi, P. Pavan, M. Meneghini, G. Meneghesso, E. Zanoni, G. Verzellesi
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引用次数: 10
Abstract
In this paper, we present simulation results that reproduce stress and recovery experiments in Carbon-doped power GaN MOS-HEMTs and explain the associated RON increase and decrease as the result of the emission, redistribution and re-trapping of holes within the Carbon-doped buffer. The proposed model can straightforwardly clarify the beneficial impact of the recently proposed p-type drain contact on RON degradation as being a consequence of enhanced hole trapping and reduced negative trapped charge within the buffer during stress.